page 1 formosa ms chip zener diode 1 2 2 2 2 3 4 5 5 6 7 7 8 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. electrical characteristics................................................................... rating and characteristic curves........................................................ pinning information........................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 zgfm5341b thru zgfm5378b document id issued date revised date revision page. ds-121743 2009/08/10 2014/02/26 e 8
batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. wide zener reverse voltage range 6.2v to 100v. small package size for high density applications. ideally suited for automated assembly processes. lead-free parts meet environmental standards of mil-std-19500 /228 features suffix "-h" indicates halogen-free part, ex.zgfm5341b-h. ? ? ? ? ? ? package outline page 2 5.0w surface mount zener diodes-6.2v-100v parameter symbol p d min. typ. max. 5.0 unit w storage temperature range operating junction temperature range t stg t j -55 -65 +150 +175 o c o c maximum ratings (at t =25 c unless otherwise noted) a o power dissipation at t = 75 c l formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 mechanical data epoxy:ul94-v0 rated flame retardant case : molded plastic, terminals : solder plated, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any weight : approximated 0.19 gram ? ? ? ? ? ? do-214ab / smc 0.272(6.9) 0.248(6.3) 0.012(0.3) typ. 0.189(4.8) 0.165(4.2) 0.098(2.5) 0.075(1.9) 0.048 (1.2) typ. 0.048(1.2) typ. dimensions in inches and (millimeters) smc document id issued date revised date revision page. thermal characteristics c/w typical thermal resistance junction to lead r jl 23 parameter symbol unit limit c/w typical thermal resistance junction to ambient r ja 50 note 1 mounted on fr-4 pcb . zgfm5341b thru zgfm5378b v f 1.20 v forward voltage at i = 1.0a f ds-121743 2009/08/10 2014/02/26 e 8
page 3 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 electrical characteristics (at t =25 c unless otherwise noted) a o marking code zener voltage te s t current zener impedance leakage current ma i zt z@ i zt zt max. i zk i r volts v r z@ i zk zk 6.51 7.14 7.88 8.61 9.14 9.56 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 23.10 25.20 200.0 175.0 175.0 150.0 150.0 150.0 125.0 125.0 100.0 100.0 100.0 75.0 75.0 70.0 65.0 65.0 65.0 50.0 50.0 1 1 1.5 1.5 2 2 2 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 3 3 3.5 3.5 5341 5342 5343 5344 5345 5346 5347 5348 5349 5350 5351 5352 5353 5354 5355 5356 5357 5358 5359 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 10.0 10.0 10.0 10.0 10.0 7.5 5.0 5.0 2.0 1.0 1.0 1.0 1.0 0.5 0.5 0.5 0.5 0.5 3.0 5.2 5.7 6.2 6.6 6.9 7.6 8.4 9.1 9.9 10.6 11.5 12.2 12.9 13.7 14.4 15.2 16.7 18.2 200 200 200 200 200 150 125 125 125 100 75 75 75 75 75 75 75 75 100 part no. zgfm5341b zgfm5342b zgfm5343b zgfm5344b zgfm5345b zgfm5346b ZGFM5347B zgfm5348b zgfm5349b zgfm5350b zgfm5351b zgfm5352b zgfm5353b zgfm5354b zgfm5355b zgfm5356b zgfm5357b zgfm5358b zgfm5359b 26.25 28.35 29.40 31.50 34.65 37.80 50.0 50.0 50.0 40.0 40.0 30.0 4 5 6 8 10 11 5360 5361 5362 5363 5364 5365 1.00 1.00 1.00 1.00 1.00 1.00 0.5 0.5 0.5 0.5 0.5 0.5 19.0 20.6 21.2 22.8 25.1 27.4 110 120 130 140 150 160 zgfm5360b zgfm5361b zgfm5362b zgfm5363b zgfm5364b zgfm5365b 40.95 45.15 49.35 53.55 30.0 30.0 25.0 25.0 14 20 25 27 5366 5367 5368 5369 1.00 1.00 1.00 1.00 0.5 0.5 0.5 0.5 29.7 32.7 35.8 38.8 170 190 210 230 zgfm5366b zgfm5367b zgfm5368b zgfm5369b nom. v@ i zzt (volts) 6.2 6.8 7.5 8.2 8.7 9.1 10 11 12 13 14 15 16 17 18 19 20 22 24 25 27 28 30 33 36 39 43 47 51 min. 5.89 6.46 7.13 7.79 8.27 8.65 9.50 10.45 11.4 12.35 13.30 14.25 15.20 16.15 17.10 18.05 19.00 20.90 22.80 23.75 25.65 26.60 28.50 31.35 34.20 37.05 40.85 44.65 48.45 58.80 20.0 35 5370 1.00 0.5 42.6 280 zgfm5370b 56 53.20 63.00 20.0 40 5371 1.00 0.5 45.5 350 zgfm5371b 60 57.00 65.10 20.0 42 5372 1.00 0.5 47.1 400 zgfm5372b 62 58.90 71.40 20.0 44 5373 1.00 0.5 51.7 500 zgfm5373b 68 64.60 78.75 20.0 45 5374 1.00 0.5 56.0 620 zgfm5374b 75 71.25 86.10 15.0 65 5375 1.00 0.5 62.2 720 zgfm5375b 82 77.90 91.35 15.0 75 5376 1.00 0.5 66.0 760 zgfm5376b 87 82.65 95.55 15.0 75 5377 1.00 0.5 69.2 760 zgfm5377b 91 86.45 105.0 12.0 90 5378 1.00 0.5 76.0 800 zgfm5378b 100 95.00 0.5 document id issued date revised date revision page. note : 5% tolerance of zener voltage ma (ua)max ()max ()max formosa ms chip zener diode zgfm5341b thru zgfm5378b ds-121743 2009/08/10 2014/02/26 e 8
page 4 rating and characteristic curves (zgfm5341b thru zgfm5378b) http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 fig.1 power temperature derating curve p , maximum power dissipation, (w) d 0 20 40 60 80 100 120 140 160 180 0 2 4 6 8 10 t , lead temperature, ( c) l o fig.2 temperature coefficient-range for units 10 to 100 voltages v temperature coefficient, (mv/ c)@i z zt o v , zener voltage, (v) z range 10 5 50 100 300 02040 60 80 100 document id issued date revised date revision page. ds-121743 2009/08/10 2014/02/26 e 8
pinning information 1 2 pin1 cathode pin2 anode pin simplified outline symbol page 5 2 1 suggested solder pad layout formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 dimensions in inches and (millimeters) a c b document id issued date revised date revision page. b 0.063 (1.60) a 0.189 (4.80) c 0.158 (4.00) package smc zgfm5341b thru zgfm5378b ds-121743 2009/08/10 2014/02/26 e 8
page 6 packing information p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 item tolerance smc carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 178.00 50.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 5.10 7.20 2.50 document id issued date revised date revision page. zgfm5341b thru zgfm5378b ds-121743 2009/08/10 2014/02/26 e 8
page 7 formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 reel packing smc 3,000 8.0 6,000 337*337*37 330 350*330*360 48,000 17.0 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) 13" document id issued date revised date revision page. profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 3.reflow soldering 10~30sec 1.storage environment: temperature=5 ~40 humidity=55%25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature zgfm5341b thru zgfm5378b ds-121743 2009/08/10 2014/02/26 e 8
page 8 formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. high reliability test capabilities zgfm5341b thru zgfm5378b ds-121743 2009/08/10 2014/02/26 e 8 1. solder resistance 2. solderability 3. high temperature reverse bias 4. pressure cooker 5. temperature cycling 6. humidity 7. high temperature storage life at 260 5 for 10 2sec. at 245 5 for 5 sec. v = 80% at t =150 for 168 hrs. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c v nom* c c cc c c o o o o oo o o zj sig a a z mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 jesd22-a102 mil-std-750d method-1051 mil-std-750d method-1021 mil-std-750d method-1031 item test conditions reference
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